Hordhaca habka sublimation kulaylka

habka sublimation hermal
mabda'a
Habka sublimation kulaylka waxaa iska leh laan ka mid ah habka daabacaadda wareejinta kulaylka, taas oo ah habka daabacaadda wareejinta, inta badan iyadoo la isticmaalayo midabyo kala firdhisan.Mabda'a daabacaadda waa in lagu daabaco qaabka warqadda wareejinta kuleylka kuleylka leh midabyo gaar ah, ka dibna ku wareeji qaabka warqadda wareejinta dharka.Adigoo isticmaalaya sifooyinka sublimation-ka ee midabada kala firdhiya heerkulka sare, midabada ayaa lagu daadiyaa dharka heerkul sarreeya oo ku saabsan 200 ℃.
sifo
1. Midabka wanaagsan iyo adkeysiga sare.Midabku wuxuu si toos ah u saameeyaa dharka habka sublimation, wuxuuna ku daraa dharka.Nolosha daabacadu waxay la mid tahay nolosha dharka, iyo cimri dhererku waa wanaagsan yahay.
2. Tiknoolajiyada sublimation thermal waxay muujin kartaa qaababka si fiican, oo leh lakabyo kala duwan, midabyo dhalaalaya iyo dareen saddex-cabbir ah.
3. Ilaalinta deegaanka cagaarka ah, wasakh la'aan, qalab fudud, biyo la'aan, iyo in la yareeyo dheecaanka bulaacada.
Farqiga u dhexeeya daabacaadda wareejinta kulaylka iyo shaabada kulul
Habka sublimation kulaylka iyo stamping kulul labaduba waxay ka tirsan yihiin tignoolajiyada wareejinta kulaylka, labaduba waxay u baahan yihiin in lagu wareejiyo waraaqda wareejinta jawi heerkul sare ah.Farqiga u dhexeeya ayaa ah in tignoolajiyada sublimation thermal inta badan ay isticmaasho midabyo kala firdhisan, iyo iyada oo loo marayo tignoolajiyada sublimation, midabada ayaa gala dharka si ay u midabeeyaan dharka.Qalab badan ayaa loo isticmaali karaa shaabada kulul, sida alaabta PU iyo warqada shaambaynta kulul, taas oo abuuri karta saameyno kala duwan sida xabagta fluorescent Q shaabada kulul iyo shaabada kulul.Nidaamku wuxuu ku yaalaa dusha sare ee dharka mana dhex gelin gudaha gudaha.
4.Thermal sublimation, taas oo macnaheedu yahay in midabka aasaasiga ah ee CMY (buluug, casaan iyo jaalle ah) midabada ay hoos u dhigaan wajiga gaaska qalab kuleyliyaha semiconductor oo lagu daabacay warqad sawir gaar ah.Maadaama unug kasta oo kuleyliyaha semiconductor uu hagaajin karo heerkulka 256, waxaa suurtagal ah in la hagaajiyo saamiga iyo xoojinta midabada.Ka dhig sawirka daabacan mid jilicsan oo siman sida buufinta, gaar ahaan ku habboon shuruudaha jilicsanaanta iyo jilicsanaanta maqaarka sida sawirada.Fiirinta sawirada daabacan ee tignoolajiyada sublimation thermal laguma bedeli karo laysarka iyo daabacadaha khad-jetka.
Sublimation iyo daabacaadda wareejinta kulaylka waxay la xiriiraan midba midka kale waxayna leeyihiin waxyaabo ay isaga mid yihiin.Dhammaanteen waan ognahay in daabacaadda wareejinta kulaylku ay tahay habka ugu horreeya ee daabacaadda sawirada iyo qoraalka warqadaha wareejinta kulaylka gaarka ah ama walxaha kale, ka dibna la isticmaalo heerkul sare iyo cadaadis sare si loo "ku dhejiyo" sawirada iyo qoraalka dusha sare ee substrate.Macnaha sublimation kuleylku waa in midabka asaasiga ah ee CMY (buluug, casaan iyo jaalle) la hoos dhigo wejiga gaaska iyadoo la adeegsanayo qalabka kuleylka unugga oo ku daabac warqadda sawir-qaadista ee gaarka ah.Sublimation kuleylku inta badan waa in la kululeeyo unugyada midabka dhexdhexaadka ah.Tiknoolajiyada daabacaadda kuleylka kuleylka waa in la isticmaalo sublimation - looma baahna gobol dhexdhexaad ah oo ka socda gobolka gaaska ilaa gobolka adag iyo laga bilaabo gobolka adag ilaa gobolka gaaska si loo xaqiijiyo daabacaadda sawirada oo daabacaan, Waxaa intaa dheer, fiilooyinka sawirada lagu daabacay kuleylka Tiknoolajiyada sublimation-ka ayaa aad uga wanaagsan kuwa lagu daabaco daabacaha laysarka ama daabacaha khad-jet.